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The first is the 10-nanometer Ice Lake, which was expected to be shipped in June this year. In this way, PC OEM manufacturers can rush to market their terminal products before the holiday shopping season.
Intel promises that 10 nm Ice Lake chips will deliver three times the wireless rate, twice the speed of video coding and graphics processing, and 2.5 to 3 times the AI performance of previous generation products.
Between 2019 and 2020, Intel also plans to introduce other products based on 10nm process, including client side products./The serverProcessor, new type of FPGA, and general-purpose GPU.
As for the 7nm process, Intel said it is expected to bring twice the size and 20% performance improvement per watt.
At the same time, Intel also promised to reduce the complexity of the design to 1/4, which is the first time the company has used extreme ultraviolet lithography (EUV) technology to help promote the development of "multi-generation process nodes."
One of the most anticipated is the general-purpose GPU architecture of the Xe series. This series of products for data center / artificial intelligence / high performance computing tasks is expected to be available in 2021.
Finally, Intel talked about its own Lakefield packaging technology, which the company had previously shown at the Consumer Electronics Show (CES 2019).
According to the company, Lakefield is expected to reduce standby power to 1/10 and increase energy efficiency to 1.5 to 2 times. In addition, it promises twice the graphics performance and half the PCB footprint.
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