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16S mobile phone "SoC no sealant"? Meizu official response: using new glue

via:Expreview超能网     time:2019/5/8 13:41:02     readed:113

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Meizu 16th

This comes from station B.Mobile phoneDismantling content@XYZONE(Former Zealer Employee@ Lou Bin XYZONEFounded), he said in the latest video on the dismantling of Meizu 16S that the SOC part of the mobile phone was not sealed (dispensing) treatment, which is a measure of further strengthening and protection after soldering the SOC onto the PCB, which can prevent the PCB from deforming, resulting in the failure of the SoC to start the mobile phone.

The statement of @XYZONE has aroused heated discussion on microblogging, gained support from many netizens, ridiculed Meizu's degeneration and began to "cut corners" because SoC is not glued normally only on low-cost 1000 yuan machines, while Meizu 16S flagship mobile phone sold for 399 yuan obviously should not have such a low-level approach.

The Official Weibo Account of Meizu after Sale@ Meizu CareSoon before the event was further fermented, they made a statement, saying that the new machine "replaced Fule 8023" new glue, which was translucent after use, had better permeability, filled the bottom more full, reduced the coverage of chip edge glue, and made the motherboard more beautiful." In response, SoC is not without glue.

But after Meizu's official statement,@ Lou Bin XYZONEStill adhere to their own views, the latest release of the SoC welding video to prove that "Meizu 16S SoC is no sealing measures!" It also emphasizes that the mobile phone is a retail version purchased at their own expense, not Meizu's media machine. It seems that things have not ended so quickly. How will Meizu respond in the future? We will continue to pay attention to the progress of the event.

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