Previously, the chips produced by TSMC and Samsung used 7Nm and 8nm processes respectively, which allow more transistors to be encapsulated in smaller areas. This makes it like Qualcomm.HUAWEIChip designers from mobile phone manufacturers such as Samsung and Apple are able to create chips that are stronger than previous generations, while at the same time consuming less power, which also enables mobile phone manufacturers to produce thinner phones. And TSMC and Samsung will use EUV lithography later this year to help the two companies produce stronger chips.
Lasertec's machine is dedicated to finding defects in EUV lithography chips. It can test glass masks passed by plasma beams to track circuit patterns and find problems. Because in the chip production stage, any defects will lead to a batch of chip scrap, so a machine is needed to detect these defects. So far, the company says it has received machine orders worth $36 million (about 241.54 million yuan). Lasertec expects more orders once TSMC and Samsung start mass-producing chips using 7Nm EUV lithography.
Although EUV lithography has high production efficiency, the cost of using EUV lithography limits the number of foundries using this process. Intel said that EUV lithography is not economically viable, and Grofford Semiconductor has decided not to use EUV lithography. According to Samsung, 7Nm EUV lithography will increase the efficiency of Samsung's chips by 40%, thereby improving performance by 20% and reducing power consumption by 50%, which is good news for future Samsung mobile phone users.