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MIDK 5G roadmap: synchronous launch of 5G modem chip Helio M70 in 2019

via:C114中国通信网     time:2018/11/29 11:37:52     readed:231

First, the challenge from chip design. As we all know, URLLC, eMBB, mMTC are the three major application scenarios of 5G, and the application fields such as autopilot, telemedicine, AR/VR application, smart city and smart grid are closely related. The chip is the basis of the terminal. When the chip design company designs the chip, it is difficult to take care of all 5G application scenarios through one or several chips. It is very difficult to provide different chip design solutions for different application scenarios or provide different levels of solutions for certain application scenarios.

Second, the challenge from mobile computing. In the future, on the one hand, it will break through the limitations of the terminal display, and on the other hand, it will break through the limitations of the location. Taking AR/VR equipment as an example, all kinds of glasses or heads are developing in the direction of lightness and miniaturization, and the integration with the real world is becoming more and more tight, and the demand for computing power is gradually increasing.

Third, the challenge from 5G terminal technology. This includes five difficulties: First, DRAM bandwidth will increase greatly due to the high speed of 5G; second, power consumption and heat dissipation will consume more power than 4G LTE in low-speed standby, while ENDC will consume more power at high speed; Third, the PCB layout area, the addition of the new frequency band and the multi-antenna requirement of NR (4R2T) will make the area larger; fourth, the complexity of the RF circuit, the interference avoidance of the multi-mode multi-band terminal RF circuit will consider more factors Fifth, the application computing power requirements will also increase, and it is expected that new applications will increase complexity with high speed.

Su Xiaofeng said that the release time of the 5G standard is still short, and it is difficult for the industry to provide a chip solution with both cost and volume. From 2018 to 2019, 5G smart terminals will generally adopt the combination mode of 4G SoC 5G Modem. The mature AP+MD 5G system single chip solution is expected to be launched in 2020.

Su Xiaofeng pointed out that MediaTek is the first wave of 5G and NB-IoT commercialization, and its NB-IoT solution has begun mass production. At the same time, MediaTek works closely with global operators and equipment vendors.DevelopmentIn-depth participation in the 5G Standards Development Committee (3GPP), in 2019 and the industry to launch the 5G modem chip Helio M70, and continue to launch 5G single-chip solution, has been fully prepared for the 2020 5G replacement tide.


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